About Wafer Dicing Saws A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips. Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass. Dicing blades of varying thickness are used to saw the wafers based on the material being sawed. Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.
Technavio’s analysts forecast the global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.
Covered in this report The report covers the present scenario and the growth prospects of the global wafer dicing saws market for 2017-2021. To calculate the market size, the report considers the revenues from major wafer dicing saws vendors..
The market is divided into the following segments based on geography: • Americas • APAC • EMEA
Technavio's report, Global Wafer Dicing Saws Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors • DISCO Corporation • TOKYO SEIMITSU • Advanced Dicing Technology • Dynatex International • Loadpoint • Micross Components
Market driver • Growing demand for IoT • For a full, detailed list, view our report
Market challenge • Volatile nature of the semiconductor industry • For a full, detailed list, view our report
Market trend • Growth of AI • For a full, detailed list, view our report
Key questions answered in this report • What will the market size be in 2021 and what will the growth rate be? • What are the key market trends? • What is driving this market? • What are the challenges to market growth? • Who are the key vendors in this market space? • What are the market opportunities and threats faced by the key vendors? • What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report. Companies Mentioned DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, and Micross Components
PART 01: Executive summary PART 02: Scope of the report PART 03: Research Methodology PART 04: Introduction • Market outline • Wafer dicing saws PART 05: Market landscape • Market overview • Market size and forecast PART 06: Five forces analysis • Five forces analysis PART 07: Market segmentation by end-user • Pureplay foundries • IDMs • PART 08: Market segmentation by packaging technology • BGA • QFN PART 09: Geographical segmentation • Market overview • APAC • Americas • EMEA PART 10: Key leading countries • Taiwan • China • Decision framework PART 11: Drivers and challenges • Market drivers • Market challenges PART 12: Market trends • Growth of AI • Increase in wafer size • Introduction of ultrasonic blade dicing • Growth of smart cities PART 13: Vendor landscape • Competitive scenario PART 14: Key vendor analysis • DISCO Corporation • TOKYO SEIMITSU • Advanced Dicing Technology • Dynatex International • Loadpoint • Micross Components PART 15: Appendix • List of abbreviations
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